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TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 TXS0104E-Q1 4-bit bidirectional voltage-level translator for open-drain and push-pull applications 1 features 3 description the TXS0104E-Q1 device connects an incompatible 1 ? qualified for automotive applications logic communication from chip-to-chip due to voltage ? aec-q100 qualified with the following results: mismatch. this auto-direction translator can be ? device temperature grade 1: ? 40 c to 125 c conveniently used to bridge the gap without the need ambient operating temperature range of direction control from the host. each channel can be mixed and matched with different output types ? device hbm esd classification level 2 (open-drain or push-pull) and mixed data flows ? device cdm esd classification level c6 (transmit or receive) without intervention from the ? no direction-control signal required host. this 4-bit noninverting translator uses two separate configurable power-supply rails. the a and ? maximum data rates b ports are designed to track v cca and v ccb ? 24 mbps maximum (push pull) respectively. the v ccb pin accepts any supply ? 2 mbps (open drain) voltage from 2.3 v to 5.5 v while the v cca pin accepts any supply voltage from 1.65 v to 3.6 v such ? 1.65 v to 3.6 v on a port and 2.3 v to 5.5 v on b that v cca is less than or equal to v ccb . this tracking port (v cca v ccb ) allows for low-voltage bidirectional translation ? no power-supply sequencing required ? v cca or between any of the 1.8-v, 2.5-v, 3.3-v, and 5-v v ccb can be ramped first voltage nodes. ? esd protection exceeds jesd 22 when the output-enable (oe) input is low, all outputs ? a port are placed in the high-impedance state. ? 2000-v human-body model (a114-b) the TXS0104E-Q1 device is designed so that the oe ? 1000-v charged-device model (c101) input circuit is supplied by v cca . ? b port to ensure the high-impedance state during power up ? 15-kv human-body model (a114-b) or power down, the oe pin must be tied to the gnd pin through a pulldown resistor; the minimum value of ? 1000-v charged-device model (c101) the resistor is determined by the current-sourcing ? iec 61000-4-2 esd (b port) capability of the driver. ? 8-kv contact discharge ? 10-kv air-gap discharge device information (1) part number package body size (nom) 2 applications TXS0104E-Q1 tssop (14) 5.00 mm 4.40 mm ? automotive infotainment, advance driver (1) for all available packages, see the orderable addendum at the end of the datasheet. assistance systems (adas) ? isolates and level translates between main transfer characteristics of an n-channel processor and peripheral modules transistor ? i 2 c or 1-wire voltage-level translation 1 an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 0 1 2 3 4 5 output voltage (v) input voltage (v) vgate = 4.3 v vgate = 3.5 v vgate = 2.8 v vgate = 2.5 v vgate = 2.2 v c001 v gate = 4.3 v v gate = 3.5 v v gate = 2.8 v v gate = 2.5 v v gate = 2.2 v productfolder sample &buy technical documents tools & software support &community
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com table of contents 7.1 load circuits ........................................................... 11 1 features .................................................................. 1 7.2 voltage waveforms ................................................. 12 2 applications ........................................................... 1 8 detailed description ............................................ 13 3 description ............................................................. 1 8.1 overview ................................................................. 13 4 revision history ..................................................... 2 8.2 functional block diagram ....................................... 13 5 pin configuration and functions ......................... 3 8.3 feature description ................................................. 14 6 specifications ......................................................... 4 8.4 device functional modes ........................................ 14 6.1 absolute maximum ratings ..................................... 4 9 application and implementation ........................ 15 6.2 handling ratings ....................................................... 4 9.1 application information ............................................ 15 6.3 recommended operating conditions ....................... 5 9.2 typical application .................................................. 15 6.4 thermal information .................................................. 5 10 power supply recommendations ..................... 16 6.5 electrical characteristics .......................................... 6 11 layout ................................................................... 17 6.6 timing requirements ? v cca = 1.8 v 0.15 v ......... 6 11.1 layout guidelines ................................................. 17 6.7 timing requirements ? v cca = 2.5 v 0.2 v .......... 6 11.2 layout example .................................................... 17 6.8 timing requirements ? v cca = 3.3 v 0.3 v ........... 7 12 device and documentation support ................. 18 6.9 switching characteristics ? v cca = 1.8 v 0.15 v ... 7 12.1 trademarks ........................................................... 18 6.10 switching characteristics ? v cca = 2.5 v 0.2 v ... 8 12.2 electrostatic discharge caution ............................ 18 6.11 switching characteristics ? v cca = 3.3 v 0.3 v ... 9 12.3 glossary ................................................................ 18 6.12 typical characteristics .......................................... 10 13 mechanical, packaging, and orderable 7 parameter measurement information ................ 11 information ........................................................... 18 4 revision history changes from revision a (april 2014) to revision b page ? changed device status from product preview to production data ........................................................................................ 1 2 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 5 pin configuration and functions 14-pin tssop pw package (top view) nc - no internal connection pin functions pin i/o description name number a1 2 i/o input-output 1 for the a port. this pin is referenced to v cca . a2 3 i/o input-output 2 for the a port. this pin is referenced to v cca . a3 4 i/o input-output 3 for the a port. this pin is referenced to v cca . a4 5 i/o input-output 4 for the a port. this pin is referenced to v cca . b1 13 i/o input-output 1 for the b port. this pin is referenced to v ccb . b2 12 i/o input-output 2 for the b port. this pin is referenced to v ccb . b3 11 i/o input-output 3 for the b port. this pin is referenced to v ccb . b4 10 i/o input-output 4 for the b port. this pin is referenced to v ccb . gnd 7 ? ground 6 nc ? no connection 9 tri-state output-mode enable. pull the oe pin low to place all outputs in tri-state mode. this pin is oe 8 o referenced to v cca . v cca 1 i a-port supply voltage. 1.65 v v cca 3.6 v and v cca v ccb . v ccb 14 i b-port supply voltage. 2.3 v v ccb 5.5 v. copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 3 product folder links: TXS0104E-Q1 1413 12 11 10 98 1 23 45 6 7 oe gnd nc a4 a3 a2 v cca nc b4 b3 b2 b1 v ccb a1
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 6 specifications 6.1 absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) min max unit v cca ? 0.5 4.6 supply voltage v v ccb ? 0.5 6.5 a1, a2, a3, a4 a port ? 0.5 4.6 input-output pin voltage, v v io (2) b1, b2, b3, b4 b port ? 0.5 6.5 a port ? 0.5 4.6 voltage range applied to any output in the high- v impedance or power-off state (2) b port ? 0.5 6.5 output voltage, v o a port ? 0.5 v cca + 0.5 voltage range applied to any output in the high or low v state (2) (3) b port ? 0.5 v ccb + 0.5 input clamp current, i ik v i < 0 ? 50 ma output clamp current, i ok v o < 0 ? 50 ma continuous output current, i o 50 ma continuous current through each v cca , v ccb , or gnd 100 ma operating virtual junction temperature range, t j ? 40 125 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. (3) the value of v cca and v ccb are provided in the recommended operating conditions table. 6.2 handling ratings min max unit t stg storage temperature range ? 65 150 c human body model (hbm), per aec q100-002 (1) ? 2.5 2.5 v (esd) electrostatic discharge kv charged device model (cdm), per aec q100-011, all pins ? 1.5 1.5 (1) aec q100-002 indicates hbm stressing is done in accordance with the ansi/esda/jedec js-001 specification. 4 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) v cca v ccb min max unit v cca supply voltage (1) 1.65 3.6 v v ccb supply voltage (1) 2.3 5.5 1.65 to 1.95 v v cca ? 0.2 v cca v ih(ax) high-level input voltage a-port i/os 2.3 to 5.5 v 2.3 to 3.6 v v cca ? 0.4 v cca v v ih(bx) high-level input voltage b-port i/os v ccb ? 0.4 v ccb 1.65 to 3.6 v 2.3 to 5.5 v v ih(oe) high-level input voltage oe input v cca 0.65 5.5 v il(ax) low-level input voltage a-port i/os 0 0.15 v il(bx) low-level input voltage b-port i/os 1.65 to 3.6 v 2.3 to 5.5 v 0 0.15 v v il(oe) low-level input voltage oe input 0 v cca 0.35 a-port i/os, 10 t/ v (ax) input transition rise or fall rate push-pull driving b-port i/os, 1.65 to 3.6 v 2.3 to 5.5 v 10 ns/v t/ v (bx) input transition rise or fall rate push-pull driving t/ v (oe) input transition rise or fall rate oe input 10 t a operating free-air temperature ? 40 125 c (1) v cca must be less than or equal to v ccb , and v cca must not exceed 3.6 v. 6.4 thermal information over operating free-air temperature range (unless otherwise noted) pw thermal metric (1) unit (14-pins) r ja junction-to-ambient thermal resistance 120.1 r jc(top) junction-to-case (top) thermal resistance 49.1 r jb junction-to-board thermal resistance 61.8 c/w jt junction-to-top characterization parameter 6.2 jb junction-to-board characterization parameter 61.2 r jc(bot) junction-to-case (bottom) thermal resistance ? (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 5 product folder links: TXS0104E-Q1
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 6.5 electrical characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) t a = 25 c t a = 25 c to 125 c parameter test conditions v cca v ccb unit min typ max min max high-level output voltage, i oh = ? 20 a, v oh(ax) 1.65 to 3.6 v 2.3 to 5.5 v v cca 0.75 v a port v i(bx) v ccb ? 0.4 v low-level output voltage, i ol = 1 ma, v ol(ax) 1.65 to 3.6 v 2.3 to 5.5 v 0.4 v a port v i(bx) 0.15 v high-level output voltage, i oh = ? 20 a, v oh(bx) 1.65 to 3.6 v 2.3 to 5.5 v v ccb 0.75 v b port v i(ax) v cca ? 0.2 v low-level output voltage, i ol = 1 ma, v ol(bx) 1.65 to 3.6 v 2.3 to 5.5 v 0.4 v b port v i(ax) 0.15 v i i(oe) input current oe v i = v cci or gnd 1.65 to 3.6 v 2.3 to 5.5 v 1 2 a off-state i oz a or b port oe = v il 1.65 to 3.6 v 2.3 to 5.5 v 1 3 a output current 1.65 to v ccb 2.3 to 5.5 v 4 v i = v o = open, i cca supply current, a port 3.6 v 0 2.2 a i o = 0 0 5.5 v ? 1 1.65 to v ccb 2.3 to 5.5 v 21 v i = v o = open, i ccb supply current, b port 3.6 v 0 ? 1 a i o = 0 0 5.5 v 5 supply current, a port plus v i = v o = open, i cca +i ccb 1.65 v to v ccb 2.3 to 5.5 v 25 a b port supply current i o = 0 input c i(oe) oe 3.3 v 3.3 v 2.5 4 pf capacitance c io(ax) a port 5 6.5 input-output 3.3 v 3.3 v pf capacitance c io(bx) b port 12 16.5 (1) v cca must be less than or equal to v ccb , and v cca must not exceed 3.6 v. 6.6 timing requirements ? v cca = 1.8 v 0.15 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.2 v 0.3 v 0.5 v unit min max min max min max push-pull driving 18 21 23 data rate mbps open-drain driving 2 2 2 push-pull driving 55 47 43 pulse duration t w data inputs ns see figure 7 open-drain driving 500 500 500 6.7 timing requirements ? v cca = 2.5 v 0.2 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.2 v 0.3 v 0.5 v unit min max min max min max push-pull driving 20 22 24 data rate mbps open-drain driving 2 2 2 push-pull driving 50 45 41 pulse duration t w data inputs ns see figure 7 open-drain driving 500 500 500 6 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 6.8 timing requirements ? v cca = 3.3 v 0.3 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 3.3 v v ccb = 5 v 0.3 v 0.5 v unit min max min max push-pull driving 22 24 data rate mbps open-drain driving 2 2 push-pull driving 45 41 pulse duration t w data inputs ns see figure 7 open-drain driving 500 500 6.9 switching characteristics ? v cca = 1.8 v 0.15 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.2 v 0.3 v 0.5 v parameter test conditions unit min max min max min max propagation delay time push-pull driving 6 5.8 5.8 t phl(a-b) (high to low) from a (input) to b (output) 8.8 9.6 10 open-drain driving see figure 8 ns propagation delay time push-pull driving 4.4 4.5 4.7 t phl(b-a) (high to low) from b (input) to a (output) 5.3 4.4 4 open-drain driving see figure 8 propagation delay time push-pull driving 7.7 6.8 7 t plh(a-b) (low to high) from a (input) to b (output) 50 26 33 open-drain driving see figure 8 ns propagation delay time push-pull driving 5.3 4.5 0.5 t plh(b-a) (low to high) from b (input) to a (output) 36 16 20 open-drain driving see figure 8 t en(oe-a) from oe (input) to a 200 200 200 enable time ns t en(oe-b) or b (output) t dis(oe-a) from oe (input) to a 200 200 200 disable time ns t dis(oe-b) or b (output) push-pull driving 9.5 9.3 15 t r(ax) rise time, a port ns open-drain driving 38 199 30 150 22 109 push-pull driving 10.8 9.1 7.6 t r(bx) rise time, b port ns open-drain driving 34 186 23 112 10 58 push-pull driving 5.9 6 13.3 t f(ax) fall time, a port open-drain driving 6.9 6.4 6.1 ns push-pull driving 7.6 7.5 8.8 t f(bx) fall time, b port open-drain driving 13.8 16.2 16.2 t sk channel-to-channel skew 1 1 1 ns push-pull driving 18 21 23 maximum data rate mbps open-drain driving 2 2 2 copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 7 product folder links: TXS0104E-Q1
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 6.10 switching characteristics ? v cca = 2.5 v 0.2 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 2.5 v v ccb = 3.3 v v ccb = 5 v 0.2 v 0.3 v 0.5 v parameter test conditions unit min max min max min max propagation delay push-pull driving 3.2 3.3 3.4 time t phl(a-b) from a (input) to b (output) 6.3 6 5.8 (high to low) open-drain driving see figure 8 ns propagation delay push-pull driving 3 3.6 4.3 time t phl(b-a) from b (input) to a (output) 4.7 4.2 4 (high to low) open-drain driving see figure 8 propagation delay push-pull driving 3.5 4.1 4.4 time t plh(a-b) from a (input) to b (output) 3.5 4.1 4.4 (low to high) open-drain driving see figure 8 ns propagation delay push-pull driving 2.5 1.6 0.7 time t plh(b-a) from b (input) to a (output) 2.5 1.6 1 (low to high) open-drain driving see figure 8 t en(oe-a) from oe (input) to a or b 200 200 200 enable time ns t en(oe-b) (output) t dis(oe-a) from oe (input) to a or b 200 200 200 disable time ns t dis(oe-b) (output) push-pull driving 7.4 6.6 5.6 t r(ax) rise time, a port ns open-drain driving 34 180 28 150 24 105 push-pull driving 8.3 7.2 6.1 t r(bx) rise time, b port ns open-drain driving 35 170 24 120 12 64 push-pull driving 5.7 5.5 5.3 t f(ax) fall time, a port ns open-drain driving 6.9 6.2 5.8 push-pull driving 7.8 6.7 6.6 t f(bx) fall time, b port ns open-drain driving 8.8 9.4 10.4 t sk channel-to-channel skew 1 1 1 ns push-pull driving 20 22 24 maximum data rate mbps open-drain driving 2 2 2 8 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 6.11 switching characteristics ? v cca = 3.3 v 0.3 v over recommended operating free-air temperature range (unless otherwise noted) v ccb = 3.3 v v ccb = 5 v 0.3 v 0.5 v parameter test conditions unit min max min max propagation delay time push-pull driving 2.4 3.1 t phl(a-b) (high to low) from a (input) to b (output) 4.2 4.6 open-drain driving see figure 8 ns propagation delay time push-pull driving 2.5 3.3 t phl(b-a) (high to low) from b (input) to a (output) 124 97 open-drain driving see figure 8 propagation delay time push-pull driving 4.2 4.4 t plh(a-b) (low to high) from a (input) to b (output) 4.2 4.4 open-drain driving see figure 8 ns propagation delay time push-pull driving 2.5 2.6 t plh(b-a) (low to high) from b (input) to a (output) 2.5 3.3 open-drain driving see figure 8 t en(oe-a) 200 200 enable time from oe (input) to a or b (output) ns t en(oe-b) t dis(oe-a) 200 200 disable time from oe (input) to a or b (output) ns t dis(oe-b) push-pull driving 5.6 5 t r(ax) rise time, a port ns open-drain driving 25 140 19 102 push-pull driving 6.4 7.4 t r(bx) rise time, b port ns open-drain driving 26 130 14 75 push-pull driving 5.4 5 t f(ax) fall time, a port ns open-drain driving 6.1 5.7 push-pull driving 7.4 7.6 t f(bx) fall time, b port ns open-drain driving 7.6 8.3 t sk channel-to-channel skew 1 1 ns push-pull driving 22 24 maximum data rate mbps open-drain driving 2 2 copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 9 product folder links: TXS0104E-Q1
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 6.12 typical characteristics v cca = 1.8 v v il(a) = 150 mv v cca = 2.7 v v il(a) = 150 mv figure 1. low-level output voltage (v ol(ax) ) figure 2. low-level output voltage (v ol(ax) ) vs low-level current (i ol(ax) ) vs low-level current (i ol(ax) ) v cca = 3.3 v v il(a) = 150 mv figure 3. low-level output voltage (v ol(ax) ) vs low-level current (i ol(ax) ) 10 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1 low-level current (ma) low-level output voltage (mv) 0 2 4 6 8 10 12 14 16 18 20 0 100 200 300 400 500 600 700 d002 v ccb = 3.3 v low-level current (ma) low-level output voltage (mv) 0 2 4 6 8 10 12 14 16 18 20 0 100 200 300 400 500 600 700 d001 v ccb = 2.7 v v ccb = 3.3 v v ccb = 5 v low-level current (ma) low-level output voltage (mv) 0 2 4 6 8 10 12 14 16 18 20 0 100 200 300 400 500 600 700 d003 v ccb = 3.3 v v ccb = 5 v
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 7 parameter measurement information 7.1 load circuits figure 4. data rate, pulse duration, propagation figure 5. data rate, pulse duration, propagation delay, output rise-time and fall-time delay, output rise-time and fall-time measurement using a push-pull driver measurement using an open-drain driver test s1 t pzl / t plz 2 v cco (t dis ) t phz / t pzh open (t en ) figure 6. load circuit for enable-time and disable-time measurement 1. t plz and t phz are the same as t dis . 2. t pzl and t pzh are the same as t en . 3. v cci is the v cc associated with the input port. 4. v cco is the v cc associated with the output port. copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 11 product folder links: TXS0104E-Q1 from output under test s1 2 v cco 50 k 50 k 15 pf open 1 m 15 pf v cco v cci dut in out 1 m 15 pf v cco v cci dut in out
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 7.2 voltage waveforms figure 7. pulse duration figure 8. propagation delay times 1. c l includes probe and jig capacitance. 2. waveform 1 in figure 9 is for an output with internal such that the output is high, except when oe is high (see figure 6 ). waveform 2 in figure 9 is for an output with conditions such that the output is low, except when oe is high. 3. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 , dv/dt 1 v/ns. 4. the outputs are measured one at a time, with one transition per measurement. 5. t plz and t phz are the same as t dis . 6. t pzl and t pzh are the same as t en . 7. t plh and t phl are the same as t pd . 8. v cci is the v cc associated with the input port. 9. v cco is the v cc associated with the output port. figure 9. enable and disable times 12 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1 output waveform 1 s1 at 2 v (see note 2) cco v oh v ol oe input output waveform 2 s1 at gnd (see note 2) t pzl t pzh t plz t phz v / 2 cca v / 2 cca 0 v v oh 0.1 v / 2 cco v oh 0.9 v / 2 cco 0 v v cca v oh t plh t phl v cci 0 v v / 2 cco v oh v ol input output v / 2 cci v / 2 cci 0.9 v cco v / 2 cco t r 0.1 v cco t f v cci 0 v v / 2 cci v / 2 cci t w input
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 8 detailed description 8.1 overview the TXS0104E-Q1 device is a directionless voltage-level translator specifically designed for translating logic voltage levels. the a port is able to accept i/o voltages ranging from 1.65 v to 3.6 v, while the b port can accept i/o voltages from 2.3 v to 5.5 v. the device is a pass gate architecture with edge rate accelerators (one shots) to improve the overall data rate. 10-k pullup resistors, commonly used in open drain applications, have been conveniently integrated so that an external resistor is not needed. while this device is designed for open drain applications, the device can also translate push-pull cmos logic outputs. 8.2 functional block diagram copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 13 product folder links: TXS0104E-Q1 one-shot accelerator 10 k a b oe 10 k v cca v ccb gate bias one-shot accelerator one-shot accelerator 10 k a b 10 k gate bias one-shot accelerator one-shot accelerator 10 k a b 10 k gate bias one-shot accelerator one-shot accelerator 10 k a b 10 k gate bias one-shot accelerator
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 8.3 feature description 8.3.1 architecture the TXS0104E-Q1 architecture (see figure 10 ) does not require a direction-control signal in order to control the direction of data flow from a to b or from b to a. figure 10. architecture of a txs01xx cell each a-port i/o has an internal 10-k ? pullup resistor to v cca , and each b-port i/o has an internal 10-k ? pullup resistor to v ccb . the output one-shots detect rising edges on the a or b ports. during a rising edge, the one-shot turns on the pmos transistors (t1, t2) for a short duration which speeds up the low-to-high transition. 8.3.2 input driver requirements the fall time (t fa , t fb ) of a signal depends on the output impedance of the external device driving the data i/os of the TXS0104E-Q1 device. similarly, the t phl and maximum data rates also depend on the output impedance of the external driver. the values for t fa , t fb , t phl , and maximum data rates in the data sheet assume that the output impedance of the external driver is less than 50 ? . 8.3.3 power up during operation, ensure that v cca v ccb at all times. during power-up sequencing, v cca v ccb does not damage the device, so any power supply can be ramped up first. 8.3.4 enable and disable the TXS0104E-Q1 device has an oe input that disables the device by setting oe low, which places all i/os in the high-impedance state. the disable time (t dis ) indicates the delay between the time when the oe pin goes low and when the outputs actually enter the high-impedance state. the enable time (t en ) indicates the amount of time the user must allow for the one-shot circuitry to become operational after the oe pin is taken high. 8.3.5 pullup and pulldown resistors on i/o lines each a-port i/o has an internal 10-k ? pullup resistor to v cca , and each b-port i/o has an internal 10-k ? pullup resistor to v ccb . if a smaller value of pullup resistor is required, an external resistor must be added from the i/o to v cca or v ccb (in parallel with the internal 10-k ? resistors). 8.4 device functional modes the TXS0104E-Q1 device has two functional modes, enabled and disabled. to disable the device set the oe input low, which places all i/os in a high impedance state. setting the oe input high will enable the device. 14 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1 v cca a b 10 k 10 k t2 t1 v ccb oneshot oneshot gate bias
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 9 application and implementation 9.1 application information the TXS0104E-Q1 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. the TXS0104E-Q1 device is ideal for use in applications where an open-drain driver is connected to the data i/os. the TXS0104E-Q1 device can also be used in applications where a push-pull driver is connected to the data i/os, but the txb0104-q1 device might be a better option for such push-pull applications. 9.2 typical application figure 11. application schematic 9.2.1 design requirements for this design example, use the parameters listed in table 1 . table 1. design parameters design parameter example value input voltage range 1.65 to 3.6 v output voltage range 2.3 to 5.5 v 9.2.2 detailed design procedure to begin the design process, determine the following: ? input voltage range ? use the supply voltage of the device that is driving the TXS0104E-Q1 device to determine the input voltage range. for a valid logic high the value must exceed the v ih of the input port. for a valid logic low the value must be less than the v il of the input port. ? output voltage range ? use the supply voltage of the device that the TXS0104E-Q1 device is driving to determine the output voltage range. ? the TXS0104E-Q1 device has 10-k internal pullup resistors. external pullup resistors can be added to reduce the total rc of a signal trace if necessary. copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 15 product folder links: TXS0104E-Q1 TXS0104E-Q1 3.3-v system 1.8-v system controller a1 a2 a3 a4 b1 b2 b3 b4 data data oe v cca v ccb 1.8 v 3.3 v gnd 0.1 f 0.1 f
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com ? an external pull down resistor decreases the output v oh and v ol . use equation 1 to calculate the v oh as a result of an external pull down resistor. v oh = v ccx r pd / (r pd + 10 k ) where ? v ccx is the supply voltage on either v cca or v ccb ? r pd is the value of the external pull down resistor (1) 9.2.3 application curve v cca = 1.8 v v ccb = 5 v figure 12. level-translation of a 2.5-mhz signal 10 power supply recommendations the TXS0104E-Q1 device uses two separate configurable power-supply rails, v cca and v ccb . v ccb accepts any supply voltage from 2.3 v to 5.5 v and v cca accepts any supply voltage from 1.65 v to 3.6 v as long as vs is less than or equal to v ccb . the a port and b port are designed to track v cca and v ccb respectively allowing for low-voltage bidirectional translation between any of the 1.8-v, 2.5-v, 3.3-v, and 5-v voltage nodes. the TXS0104E-Q1 device does not require power sequencing between v cca and v ccb during power-up so the power-supply rails can be ramped in any order. a v cca value greater than or equal to v ccb (v cca v ccb ) does not damage the device, but during operation, v cca must be less than or equal to v ccb (v cca v ccb ) at all times. the output-enable (oe) input circuit is designed so that it is supplied by v cca and when the (oe) input is low, all outputs are placed in the high-impedance state. to ensure the high-impedance state of the outputs during power up or power down, the oe input pin must be tied to gnd through a pulldown resistor and must not be enabled until v cca and v ccb are fully ramped and stable. the minimum value of the pulldown resistor to ground is determined by the current-sourcing capability of the driver. 16 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1 2 v/div 2 v 5 v 10 ns/div
TXS0104E-Q1 www.ti.com sces853b ? november 2013 ? revised may 2014 11 layout 11.1 layout guidelines to ensure reliability of the device, following common printed-circuit board layout guidelines is recommended. ? bypass capacitors should be used on power supplies. ? short trace lengths should be used to avoid excessive loading. ? pcb signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 30 ns, ensuring that any reflection encounters low impedance at the source driver. ? placing pads on the signal paths for loading capacitors or pullup resistors to help adjust rise and fall times of signals depending on the system requirements 11.2 layout example figure 13. TXS0104E-Q1 layout example copyright ? 2013 ? 2014, texas instruments incorporated submit documentation feedback 17 product folder links: TXS0104E-Q1 v ccb 1 2 3 4 5 6 7 14 13 12 11 10 9 8 a1 a2 a3 a4 nc gnd oe nc b4 b3 b2 b1 v ccb v cca v cca legend via to power plane via to gnd plane (inner layer) polygonal copper pour to system to system to system to system to controller to controller to controller to controller keep oe low until v cca and v ccb are powered up pads on signal paths for potential rise and fall time adjustments bypass capacitors
TXS0104E-Q1 sces853b ? november 2013 ? revised may 2014 www.ti.com 12 device and documentation support 12.1 trademarks all trademarks are the property of their respective owners. 12.2 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.3 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms and definitions. 13 mechanical, packaging, and orderable information the following pages include mechanical packaging and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. 18 submit documentation feedback copyright ? 2013 ? 2014, texas instruments incorporated product folder links: TXS0104E-Q1
package option addendum www.ti.com 21-may-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples txs0104eqpwrq1 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr -40 to 125 04eq1 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
package option addendum www.ti.com 21-may-2014 addendum-page 2 other qualified versions of TXS0104E-Q1 : ? catalog: txs0104e note: qualified version definitions: ? catalog - ti's standard catalog product
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant txs0104eqpwrq1 tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 package materials information www.ti.com 9-may-2015 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) txs0104eqpwrq1 tssop pw 14 2000 367.0 367.0 35.0 package materials information www.ti.com 9-may-2015 pack materials-page 2

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